Electrosurgical generators and sensors

ABSTRACT

A sensor for sensing current includes a current sensor coil and at least one active lead and at least one return lead. The current sensor coil includes an outer coil and an inner coil coupled to and disposed within the outer coil. The at least one active lead and the at least one return lead pass through the current sensor coil opening. The current sensor coil is configured to output a differential signal indicative of a current within the at least one active lead and the at least one return lead.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is related to U.S. patent application Ser. No.14/557,533, and U.S. patent application Ser. No. 14/557,579 both ofwhich were filed on Dec. 2, 2014. The entire contents of each of theabove applications are hereby incorporated herein by reference.

BACKGROUND

Technical Field

The present disclosure relates to an electrosurgical system and methodfor operating an electrosurgical generator. More particularly, thepresent disclosure relates to a system, apparatus, and method formeasuring current in an electrosurgical generator.

Background of Related Art

Electrosurgery involves application of high radio frequency electricalcurrent to a surgical site to cut, ablate, or coagulate tissue. Inmonopolar electrosurgery, a source or active electrode delivers radiofrequency alternating current from the electrosurgical generator to thetargeted tissue. A patient return electrode is placed remotely from theactive electrode to conduct the current back to the generator.

In bipolar electrosurgery, return and active electrodes are placed inclose proximity to each other such that an electrical circuit is formedbetween the two electrodes (e.g., in the case of an electrosurgicalforceps). In this manner, the applied electrical current is limited tothe body tissue positioned between the electrodes. Accordingly, bipolarelectrosurgery generally involves the use of instruments where it isdesired to achieve a focused delivery of electrosurgical energy betweentwo electrodes positioned on the instrument, e.g. forceps or the like.Electrosurgical procedures outlined above may utilize various tissue andenergy parameters in a feedback-based control system. There is continualneed to improve sensors that measure various tissue and energyproperties utilized in the feedback-based control systems.

SUMMARY

Various embodiments of the present disclosure are described herein withreference to the drawings wherein:

According to one embodiment of the present disclosure, a sensor forsensing current is provided. The sensor includes a current sensor coiland at least one active lead and/or at least one return lead. Thecurrent sensor coil includes an outer coil and an inner coil coupled toand disposed within the outer coil. The at least one active lead and/orthe at least one return lead pass through the current sensor coilopening. The current sensor coil is configured to output a differentialsignal indicative of a current within the at least one active leadand/or the at least one return lead.

In embodiments, the sensor may further include a conditioning circuitconfigured to integrate, amplify, or filter the differential signal tooutput a processed signal indicative of the current. The conditioningcircuit may be fully-differential.

In embodiments, the sensor may further include at least one shieldingmember disposed over the outer coil. The current sensor coil may bedisposed within a printed circuit board. The printed circuit board mayinclude a plurality of outer conductive traces. Each outer conductivetrace may be coupled to the at least one active lead. The outerconductive traces may be interconnected by at least one via through theprinted circuit board. The printed circuit board may further include atop dielectric layer, a first dielectric intermediate layer, a bottomdielectric layer, and a second dielectric intermediate layer. The outerconductive traces may be disposed over the outer surfaces of the bottomand top dielectric layers. A plurality of inner and outer vias mayinterconnect the pluralities of top and bottom conductive traces. Theshielding member may be disposed over an outer dielectric layer, whichis disposed over the outer surface of at least one of the top dielectriclayer or the bottom dielectric layer. The inner coil may include atleast one conductive trace disposed within the outer coil and betweenthe first and second dielectric intermediate layers of the printedcircuit board. In embodiments, the shielding member may be disposed overat least one of the top dielectric layer or the bottom dielectric layer.

In embodiments, the current sensor coil may include diametricallyopposed first and second ends. Each of the outer coil and the inner coilmay include first and second portions. The first and second portions maybe separated at the second end. The conditioning circuit may includefirst and second terminals coupled to the first and second portions ofthe outer coil, respectively. The first and second portions of the innercoil may be coupled to a third ground terminal at the first end. Thefirst portions of the outer coil and the inner coil may be coupled toeach other at the second end and the second portions of the outer coiland the inner coil may be coupled to each other at the second end.

In embodiments, the at least one active lead and/or the at least onereturn lead may be symmetrically disposed over the current sensor coilabout an axis defined between the first and second ends. The at leastone active lead and/or the at least one return lead may be disposed at anon-zero angle relative to the axis. The at least one active lead and/orthe at least one return lead may be disposed transversely relative tothe axis.

In another aspect of the present disclosure, another embodiment of asensor for sensing current is provided. The sensor includes a currentsensor coil and at least one active lead. The current sensor coildefines an opening therethrough and diametrically opposed first andsecond ends. The current sensor coil includes an outer coil and an innercoil. The outer coil includes a first semi-circular portion and a secondsemi-circular portion. The inner coil is disposed within the outer coiland includes a first semi-circular portion and a second semi-circularportion. The first semi-circular portions and the second semi-circularportions of the inner and outer coils are separated at the second end.The at least one active lead passes through the current sensor coil. Thecurrent sensor coil is configured to output a signal indicative of acurrent within the at least one active lead.

In embodiments, a conditioning circuit may be coupled to the inner andouter coils at the first end. The conditioning circuit is configured toat least one of integrate, amplify, or filter the differential signal tooutput a signal indicative of the current.

In embodiments, the sensor may include at least one return lead passingthrough the current sensor coil. The current sensor coil may beconfigured to output a second signal indicative of a current within theat least one return lead.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the present disclosure are described herein withreference to the drawings wherein:

FIG. 1 is a perspective view of the components of one illustrativeembodiment of an electrosurgical system according to the presentdisclosure;

FIG. 2 is a front view of one embodiment of an electrosurgical generatoraccording to the present disclosure;

FIG. 3 is a schematic, block diagram of the embodiment of anelectrosurgical generator of FIG. 2 according to the present disclosure;

FIG. 4 is a schematic diagram of a current sensor according to thepresent disclosure;

FIG. 5 is a partially-exposed, isometric view of a current sensordisposed within a printed circuit board according to the presentdisclosure;

FIG. 6 is a partially-exposed, plan view of a current sensor coil ofFIG. 5 according to the present disclosure;

FIG. 7 is an enlarged schematic view of the current sensor coil of FIG.6 according to the present disclosure;

FIG. 8 is a side, partial cross-sectional view of the printed circuitboard of FIG. 5 according to the present disclosure;

FIG. 9 is a plan view of the printed circuit board of FIG. 5 accordingto the present disclosure;

FIG. 10 is a schematic circuit diagram of a gain amplifier according tothe present disclosure;

FIG. 11 is a schematic circuit diagram of a differential to single-endedamplifier according to the present disclosure;

FIG. 12 is a schematic circuit diagram of a high-pass filter accordingto the present disclosure;

FIG. 13 is a schematic circuit diagram of a low-pass filter according tothe present disclosure;

FIG. 14 is a schematic circuit diagram of an integrator according to thepresent disclosure;

FIG. 15 is a plot of individual and combined gain response of thecurrent sensor coil of FIG. 4 and the integrator shown in FIG. 14according to the present disclosure;

FIG. 16 is a schematic diagram of the current sensor coil of FIG. 4according to the present disclosure;

FIG. 17 is a schematic diagram of a differential-mode current sensorcoil according to the present disclosure;

FIG. 18 shows another embodiment of a current sensor and conditioningcircuit according to the present disclosure;

FIG. 19 is a schematic diagram of the differential-mode current sensorcoil of FIG. 17 according to the present disclosure.

FIG. 20 is a plot of individual and combined gain response of a currentsensor coil, an integrator, a bandpass filter shown in FIG. 18 accordingto the present disclosure;

FIG. 21 is a schematic diagram of the current sensor of FIG. 18according to the present disclosure;

FIG. 22 is a schematic diagram of the current sensor of FIG. 18 withparasitic capacitive coupling according to the present disclosure;

FIG. 23 is a schematic diagram of the current sensor of FIG. 18 withbalanced out parasitic capacitive coupling according to the presentdisclosure;

FIG. 24 is a schematic diagram of the current sensor of FIG. 18 having ashielding member according to the present disclosure;

FIG. 25A is a perspective view of a current sensor coil according to thepresent disclosure;

FIG. 25B is a front view of the current sensor coil of FIG. 25Aaccording to the present disclosure;

FIG. 25C is a side view of the current sensor coil of FIG. 25A accordingto the present disclosure;

FIG. 25D is an exploded view of the current sensor coil of FIG. 25Aaccording to the present disclosure;

FIG. 25E is a plan view of the current sensor coil of FIG. 25A accordingto the present disclosure;

FIG. 26A is a partially-exposed, plan view of a current sensor coil ofthe current sensor of FIG. 25A according to one embodiment of thepresent disclosure;

FIG. 26B is an enlarged area 26B of the current sensor coil of FIG. 26Aaccording to the present disclosure;

FIG. 26C is an enlarged area 26C of the current sensor coil of FIG. 26Aaccording to the present disclosure;

FIG. 26D is a perspective, schematic view of the current sensor coil ofFIG. 26A according to the present disclosure;

FIG. 26E is a plot of an erroneous error signal as function of wireposition of the current sensor coil of FIG. 26A as a function of anangle of leads passing therethrough according to the present disclosure;

FIG. 26F is a schematic diagram of the current sensor coil of FIG. 26Awith parasitic capacitive coupling according to the present disclosure;

FIG. 27A is a perspective, schematic view of a current sensor coilaccording to another embodiment of the present disclosure;

FIG. 27B is a schematic diagram of the current sensor of FIG. 27Aaccording to the present disclosure;

FIG. 28A is a perspective, schematic view of the current sensor coilaccording to another embodiment of the present disclosure;

FIG. 28B is a schematic diagram of the current sensor of FIG. 28A withparasitic capacitive coupling according to the present disclosure;

FIG. 29A is a perspective, schematic view of the current sensor coilaccording to another embodiment of the present disclosure;

FIG. 29B is a plot of an erroneous error signal as function of leadposition of the current sensor coil of FIG. 29A as a function of anangle of leads passing therethrough according to the present disclosure;

FIG. 29C is a schematic diagram of the current sensor of FIG. 29A withparasitic capacitive coupling according to the present disclosure;

FIG. 30A is a perspective, schematic view of the current sensor coilaccording to another embodiment of the present disclosure;

FIG. 30B is a plot of an erroneous error signal as function of leadposition of the current sensor coil of FIG. 30A as a function of anangle of leads passing therethrough according to the present disclosure;

FIG. 30C is a schematic diagram of the current sensor of FIG. 30A withparasitic capacitive coupling according to the present disclosure;

FIG. 31A is a perspective, schematic view of the current sensor coilaccording to another embodiment of the present disclosure;

FIG. 31B is a plot of an erroneous error signal as function of leadposition of the current sensor coil of FIG. 31A as a function of anangle of leads passing therethrough according to the present disclosure;

FIG. 31C is a schematic diagram of the current sensor of FIG. 31A withparasitic capacitive coupling according to the present disclosure;

FIG. 32A is a partially-exposed, plan view of a current sensor coil ofthe current sensor according to another embodiment of the presentdisclosure;

FIG. 32B is a perspective, schematic view of the current sensor of FIG.32A according to the present disclosure; and

FIG. 33 is a partially-exposed, plan view of a current sensor coil ofthe current sensor according to a further embodiment of the presentdisclosure.

DETAILED DESCRIPTION

Particular embodiments of the present disclosure are describedhereinbelow with reference to the accompanying drawings. In thefollowing description, well-known functions or constructions are notdescribed in detail to avoid obscuring the present disclosure inunnecessary detail.

A generator according to the present disclosure can perform monopolarand/or bipolar electrosurgical procedures, including, for example,cutting, coagulation, ablation, and vessel sealing procedures. Thegenerator may include a plurality of outputs for interfacing withvarious electrosurgical instruments (e.g., a monopolar instrument,return electrode, bipolar electrosurgical forceps, footswitch, etc.).Further, the generator includes electronic circuitry configured togenerate radio frequency energy specifically suited for variouselectrosurgical modes (e.g., cut, blend, coagulate, division withhemostasis, fulgurate, spray, etc.) and procedures (e.g., monopolar,bipolar, vessel sealing). In embodiments, the generator may be embedded,integrated or otherwise coupled to the electrosurgical instrumentsproviding for an all-in-one electrosurgical apparatus. In furtherembodiments, the generator may include a current sensor coil configuredto sense current supplied to one or more electrosurgical instruments.The current sensor coil according to the present disclosure minimizesand/or eliminates, the unwanted signal that is coupled via the parasiticcapacitances, which can lead to erroneous current sensor measurements.In embodiments, coupling is directed to ground through a shieldingmember. In further embodiments, the signal is zeroed by coupling anadditional equal, but opposite voltage signal.

FIG. 1 is a perspective view of the components of one illustrativeembodiment of a bipolar and monopolar electrosurgical system 10according to the present disclosure. The system 10 may include one ormore monopolar electrosurgical instruments 20 having one or more activeelectrodes 23 (e.g., electrosurgical cutting probe, ablationelectrode(s), etc.) for treating tissue of a patient. Electrosurgicalalternating current is supplied to the instrument 20 by a generator 200via a supply line 24 that is connected to an active terminal 230 (FIG.3) of the generator 200, allowing the instrument 20 to cut, coagulate,ablate and/or otherwise treat tissue. The alternating current isreturned to the generator 200 through a return electrode pad 26 via areturn line 28 at a return terminal 232 (FIG. 3) of the generator 200.For monopolar operation, the system 10 may include a plurality of returnelectrode pads 26 that, in use, are disposed on a patient to minimizethe chances of tissue damage by maximizing the overall contact area withthe patient. In addition, the generator 200 and the return electrodepads 26 may be configured for monitoring tissue-to-patient contact toensure that sufficient contact exists therebetween.

The system 10 may also include one or more bipolar electrosurgicalinstruments, for example, a bipolar electrosurgical forceps 30 havingone or more electrodes for treating tissue of a patient. Theelectrosurgical forceps 30 includes a housing 31 and opposing jawmembers 33 and 35 disposed at a distal end of a shaft 32. The jawmembers 33 and 35 have one or more active electrodes 34 and a returnelectrode 36 disposed therein, respectively. The active electrode 34 andthe return electrode 36 are connected to the generator 200 through cable38 that includes the supply and return lines 24, 28 coupled to theactive and return terminals 230, 232, respectively (FIG. 3). Theelectrosurgical forceps 30 is coupled to the generator 200 at aconnector having connections to the active and return terminals 230 and232 (e.g., pins) via a plug disposed at the end of the cable 38, whereinthe plug includes contacts from the supply and return lines 24, 28 asdescribed in more detail below.

With reference to FIG. 2, a front face 240 of the generator 200 isshown. The generator 200 may be any suitable type (e.g.,electrosurgical, microwave, etc.) and may include a plurality ofconnectors 250, 252, 254, 256, 258, 260, 262 to accommodate varioustypes of electrosurgical instruments (e.g., electrosurgical forceps 30,etc.).

The generator 200 includes a user interface 241 having one or moredisplay screens or information panels 242, 244, 246 for providing theuser with variety of output information (e.g., intensity settings,treatment complete indicators, etc.). Each of the screens 242, 244, 246is associated with corresponding connectors 250-262. The generator 200includes suitable input controls (e.g., buttons, activators, switches,touch screen, etc.) for controlling the generator 200. The displayscreens 242, 244, 246 are also configured as touch screens that displaya corresponding menu for the electrosurgical instruments (e.g.,electrosurgical forceps 30, etc.). The user then adjusts inputs bysimply touching corresponding menu options.

Screen 242 controls monopolar output and the devices connected to theconnectors 250 and 252. Connector 250 is configured to couple to amonopolar electrosurgical instrument (e.g., electrosurgical instrument20) and connector 252 is configured to couple to a foot switch (notshown). The foot switch provides for additional inputs (e.g.,replicating inputs of the generator 200). Connector 254 is configured tocouple to electrode pad 26. Screen 244 controls monopolar and bipolaroutput and the devices connected to the connectors 256 and 258.Connector 256 is configured to couple to other monopolar instruments.Connector 258 is configured to couple to a bipolar instrument (notshown).

Screen 246 controls bipolar sealing procedures performed by the forceps30 that may be plugged into the connectors 260 and 262. The generator200 outputs energy through the connectors 260 and 262 suitable forsealing tissue grasped by the forceps 30. In particular, screen 246outputs a user interface that allows the user to input a user-definedintensity setting. The user-defined setting may be any setting thatallows the user to adjust one or more energy delivery parameters, suchas power, current, voltage, energy, etc. or sealing parameters, such asenergy rate limiters, sealing duration, etc. The user-defined setting istransmitted to a controller 224 of generator 200 (FIG. 3) where thesetting may be saved in memory 226. In embodiments, the intensitysetting may be a number scale, such as for example, from one to ten orone to five. In embodiments, the intensity setting may be associatedwith an output curve of the generator 200. The intensity settings may bespecific for each forceps 30 being utilized, such that variousinstruments provide the user with a specific intensity scalecorresponding to the forceps 30.

FIG. 3 shows a schematic block diagram of the generator 200 configuredto output electrosurgical energy. The generator 200 includes acontroller 224, a power supply 227, and a radio-frequency (RF) amplifier228. The power supply 227 may be a high voltage, DC power supplyconnected to an AC source (e.g., line voltage) and provides highvoltage, DC power to the RF amplifier 228 via leads 227 a and 227 b,which then converts high voltage, DC power into treatment energy (e.g.,electrosurgical or microwave) and delivers the energy to the activeterminal 230. The current is returned thereto via the return terminal232 as energy is dissipated into the tissue. The active and returnterminals 230 and 232 are coupled to the RF amplifier 228 through anisolation transformer 229. The RF amplifier 228 is configured to operatein a plurality of modes, during which the generator 200 outputscorresponding waveforms having specific duty cycles, peak voltages,crest factors, etc. It is envisioned that in other embodiments, thegenerator 200 may be based on other types of suitable power supplytopologies.

The controller 224 includes a processor 225 operably connected to amemory 226, which may include transitory type memory (e.g., RAM) and/ornon-transitory type memory (e.g., flash media, disk media, etc.). Theprocessor 225 includes an output port that is operably connected to thepower supply 227 and/or RF amplifier 228 allowing the processor 225 tocontrol the output of the generator 200 according to either open and/orclosed control loop schemes. A closed loop control scheme is a feedbackcontrol loop, in which a plurality of sensors measure a variety oftissue and energy properties (e.g., tissue impedance, tissuetemperature, output power, current and/or voltage, etc.), and providefeedback to the controller 224. The controller 224 then signals thepower supply 227 and/or RF amplifier 228, which adjusts the DC and/orpower supply, respectively. Those skilled in the art will appreciatethat the processor 225 may be substituted for by using any logicprocessor (e.g., control circuit) adapted to perform the calculationsand/or set of instructions described herein including, but not limitedto, field programmable gate array, digital signal processor, andcombinations thereof.

The generator 200 according to the present disclosure includes aplurality of sensors 280, e.g., an RF current sensor 280 a, and an RFvoltage sensor 280 b. Various components of the generator 200, namely,the RF amplifier 228, the RF current and voltage sensors 280 a and 280b, may be disposed on a printed circuit board (PCB). The RF currentsensor 280 a is coupled to the plurality of active leads 228 a and/orplurality of return leads 228 b and provides measurements of the RFcurrent supplied by the RF amplifier 228. The RF voltage sensor 280 b iscoupled to the active and return terminals 230 and 232 and providesmeasurements of the RF voltage supplied by the RF amplifier 228. Inembodiments, the RF current and voltage sensors 280 a and 280 b may becoupled to active and return leads 228 a and 228 b, which interconnectthe active and return terminals 230 and 232 to the RF amplifier 228,respectively.

The RF current and voltage sensors 280 a and 280 b provide the sensed RFvoltage and current signals, respectively, to the controller 224, whichthen may adjust output of the power supply 227 and/or the RF amplifier228 in response to the sensed RF voltage and current signals. Thecontroller 224 also receives input signals from the input controls ofthe generator 200, the instrument 20 and/or forceps 30. The controller224 utilizes the input signals to adjust the power output by thegenerator 200 and/or performs other control functions thereon.

Transformers are conventionally used as current and voltage sensors asthey provide a required patient isolation. However, the gain thattransformers provide fluctuates due to temperature, signal amplitude,etc. This makes accurate readings difficult with respect to the phaseand gain-bandwidth of the sensor signals. As a result, the signals needto be post-processed to arrive at accurate representations. The presentdisclosure provides for novel current sensor 280 a which overcome theproblems of conventional sensors.

FIG. 4 shows an RF current sensor 300, which includes a conditioningcircuit 301 and a current sensor coil 302. As used herein, the term“current sensor coil” refers to an electrical device for measuringalternating current (e.g., RF current) and includes an outer conductorcoil (e.g., toroid) that acts as an active conductor wrapped around aninner conductor, a so-called “Bucking coil” that acts as a returnconductor and a lead 228 a carrying the current passing through anopening 303 (FIG. 6) in the coil 302. The coil 302 may have any suitableshape such as helical, toroidal, etc. In embodiments, the coil may havea polygonal cross-section. The current sensor coil 302 may include a lowpermeability core (e.g., air core) and provides a voltage output havinga time-derivative of the current being measured to a conditioningcircuit that integrates the output to provide a voltage signalindicative of the current. In embodiments, the current sensor coil 302may be implemented on a printed circuit board and may include an openingso that the current sensor coil 302 may be wrapped about the conductorcarrying the current to be measured. In further embodiments, the currentsensor coil 302 may also be implemented using wire and may be woundaround a toroidal magnetic core.

The current sensor coil 302 is coupled to conditioning circuit 301having a resistor network 304, which includes resistors 304 a and 304 b.In embodiments, the conditioning circuit 301 may be implemented as anyintegrator (e.g., logic processor) or differential amplifier. Theresistor network 304 removes resonance of the coil 302 at its resonantfrequency. As described in further details below with respect to FIGS.5-9, the current sensor coil 302 is disposed about one or more activeleads 228 a and the coil 302 is configured to measure the currentpassing therethrough as a sensor signal. The sensor signal from the coil302 is then supplied to an optional gain amplifier 306 which increasesthe amplitude of the sensor signal and buffers the coil 302. The gainamplifier 306 or the coil 302, if the gain amplifier 306 is not used, isalso coupled to an amplifier 308, which is in turn, coupled to abandpass filter 310. The amplifier 308 is a differential-to-single-endedconverter whose function is to convert the differential signal from thecoil 302 to a single-ended signal. The amplifier 308 may have amonolithic configuration that provides improved common mode rejection.

The bandpass filter 310 removes higher and lower frequency components ofthe sensor signal which is then transmitted to an integrator 312. Sincethe voltage that is induced in the current sensor coil 302 isproportional to the rate of change of current that is flowing throughthe active lead 228 a, the integrator 312 is utilized to provide anoutput sensor signal that is proportional to the current.

In embodiments, the integrator 312 may be coupled to a switchableattenuation circuit 314, which may include one or more actively switchedcomponents. The attenuation circuit 314 may then be coupled toadditional components such as an offset circuit 316, analog-digitalconverters, and the like prior to supplying the signal to the controller224.

FIGS. 5-9 show the current sensor coil 302 according to the presentdisclosure. The coil 302 has a substantially circular shape having anopening 303 (FIG. 6) defined therethrough. The active lead 228 a isdisposed through the opening 303 of the coil 302, allowing the coil 302to measure the current flow through the active lead 228 a. If the returnlead 228 b is also being measured, additional traces may be used toprovide for passage through the opening 303 of the current sensor coil302 as described in detail below with respect to FIGS. 17-33.

As shown in FIGS. 5 and 6, the coil 302 has a substantially toroidalshape and is formed on a printed circuit board (PCB) 400 and includes aninner circumferential region 302 a and an outer circumferential region302 b. The coil 302 includes forming an inner portion (“Bucking coil”)405 of the coil 302 and an outer coil 407. In embodiments, the coil 302may have any other suitable shape (e.g., having a polygonalcross-section) with the outer coil 407 wrapped about the inner coil 405and defining an opening through the coil 302. In embodiments, the coil302 may be a coil-wrapped phenolic toroid having a low permeability(μ₀).

In embodiments, where only one of the active leads 228 a is used, themagnetic field is reflective of the current Ip passing only through theactive lead 228 a. The outer coil 407 detects the magnetic field ineither embodiment and produces a first voltage corresponding to thefirst magnetic field. The outer coil 407 also may detect a secondunwanted magnetic field and produces a second voltage corresponding tothe second magnetic field. The second magnetic field is orthogonal tothe first magnetic field and is not related to the sensed current. Theinner coil 405 senses the second magnetic field and produces a thirdvoltage proportional to the second magnetic field. The second voltageand third voltage produced have approximately the same magnitude suchthat they cancel each other. In embodiments where the plurality ofactive leads 228 a and/or plurality of return leads 228 b are disposedtogether, the current flowing through the active leads 228 a and returnleads 228 b produce a net first magnetic field proportional to thesensed current Is.

The PCB 400 may be a multilayer PCB formed from any suitable dielectricmaterial, including, but not limited to composite materials composed ofwoven fiberglass cloth with an epoxy resin binder such as FR-4 grade asdesignated by National Electrical Manufacturers Association. As shown inFIG. 8, the PCB 400 includes a first or top layer 404 a and a bottomlayer 404 e. For simplicity FIG. 5, FIG. 6, FIG. 8, and FIG. 9 will showonly the active lead 230. It will be understood that in every case aplurality of active leads and/or a plurality of return leads may beused. The active lead 228 a is coupled to conductive traces 408 a and408 f, respectively, which are disposed over the top and bottom layers404 a and 404 e as shown in FIGS. 8 and 9. The active lead 228 a may becoupled to a patient side connector 420 disposed on the PCB 400 as shownin FIG. 9. The traces 408 a and 408 f are interconnected through theopening 303 (FIG. 6) using one or more vias 409 a, which pass throughthe entire PCB 400 (e.g., layers 404 a-404 e).

The outer coil 407 includes a top trace 408 b disposed between the toplayer 404 a and an intermediate layer 404 b of the PCB 400. The outercoil 407 also includes a bottom trace 408 e disposed between the bottomlayer 404 e and an intermediate layer 404 d of the PCB 400. The traces408 b and 408 e are interconnected by a plurality of inner vias 409 band outer vias 409 c. The layers 404 a and 404 e insulate the coil 302(e.g., outer coil 407) conductive traces 408 a and 408 f and provide anisolation barrier between the patient and the generator 200.

As shown in FIGS. 5-7, the inner vias 409 b are arranged to form theinner circumferential region 302 a of the coil 302 and the outer vias409 c form the outer circumferential region 302 b of the coil 302. Theinner and outer vias 409 b and 409 c pass through the layers 404 b, 404c, and 404 d. The inner vias 409 b and outer vias 409 c may be disposedin a concentric configuration. In a non-staggered configuration,corresponding inner and outer vias 409 b and 409 c lie along same rays.In a staggered configuration, the inner and outer vias 409 b and 409 clie along alternating rays “r” as shown in FIGS. 5-7. The rays “r” aredisposed at and an angle “α” relative to each other and the inner vias409 b are separated by a distance “d.” Each of the inner vias 409 b isconnected to two neighboring outer vias 409 c through traces 408 b and408 e and vice versa. The interconnection of the vias 409 b and 409 cwith the traces 408 b and 408 e forms a plurality of loops, which inturn, form the outer coil 407 as shown in FIG. 5.

The outer coil 407 may include any suitable number of turns, inembodiments from about 50 turns to about 100 turns. The maximum numberof turns depends on the radius of the inner circumferential region 302a, via aspect ratio, thickness of the outer coil traces 407 and/or PCB400, and spacing between the turns based on the limits ofmanufacturability of the PCB material (e.g., trace to trace, trace tovia, via annular pad dimension, anything that may limit the placement ofthe conductors on the PCB).

With reference to FIGS. 6 and 8, the inner coil 405 is disposed withinthe outer coil 407 and also has a substantially circular shape. Theinner coil 405 may include an upper trace 408 c and a bottom trace 408d. The traces 408 c and 408 d are disposed over a dielectric layer 404c, such that the traces 408 c and 408 d are insulated from each other.The traces 408 c and 408 d may be electrically coupled to each other. Inembodiments, the inner coil 405 may be formed from a single trace.

As shown in FIGS. 6 and 9, the coil 302 is coupled to the conditioningcircuit 301 at a side connector 422, which may also be disposed on thePCB 400. The coil 302 includes a first terminal 410 a coupled to theinner coil 405 and a second terminal 410 b coupled to the outer coil407. In particular, the outer coil 407 is disposed over the inner coil405 and is coupled thereto. Thus, two terminals 410 a and 410 b aredisposed at one end of the coil 302. The interconnection between theinner coil 405 and the outer coil 407 as well as the connection to theterminals 410 a and 410 b may be made through the vias 409 b and 409 c.

The controller 224 is provided to sensor signals from the sensor 300,which are then utilized to determine the current. Various formulas maybe utilized by the controller 224 to determine the current. The voltageproduced by the coil 302 may be calculated using the formula (I):

$\begin{matrix}{V_{OUT} = {\frac{{- A_{LOOP}}N_{LOOPS}}{2\pi\; R_{COIL}}\mu_{0}\frac{dI}{dt}}} & (I)\end{matrix}$

In formula (I), A is the area of the turn (e.g., loop) formed by thevias 409 b and 409 c with the traces 408 b and 408 e, N is the number ofturns, R is the major radius of the coil 302, μ₀ is the magneticconstant, dI/dt is the rate of change of the current being measured bythe coil 302.

Inductance and capacitance of the coil may be calculated using theformulae (II)-(IV), respectively. Capacitance of the coil 302 is used todetermine self-resonance and may be calculated using parallel-wire modelformulae, namely, capacitances of inner and outer vias 409 b and 409 cand traces 408 b and 408 e.

$\begin{matrix}{L_{Coil} = {\frac{\mu_{0} \cdot N_{Turns}^{2} \cdot t_{coil}}{2\pi}{\ln( \frac{r_{{coil}\;\_\;{inner}} + w_{coil}}{r_{{coil}\;\_\;{inner}}} )}}} & ({II}) \\{C_{Coil} = {N_{Turns} \cdot ( {{2 \cdot C_{{trace}\text{-}{trace}}} + C_{{via}\text{-}{inner}} + C_{{via}\text{-}{outer}}} )}} & ({III}) \\{C_{||} = \frac{\pi \cdot ɛ_{0} \cdot ɛ_{r} \cdot l_{{trace}/{via}}}{\ln( {\frac{d_{{between}\;\_\;{{trace}/{via}}}}{2 \cdot r_{{via}/{trace}}} + \sqrt{\frac{d_{{between}\;\_\;{{trace}/{via}}}^{2}}{r_{{via}/{trace}}^{2}} - 1}} )}} & ({IV})\end{matrix}$

In formulae (II)-(IV), in addition to the variable and constantsutilized in formula (I), t is thickness (e.g., distance betweenconductive traces 408 b and 408 e), r is radius, w is the radialdistance between inner and outer circumferential regions 302 a and 302b, Rcoil_inner is the radial distance to the inner circumferentialregion 302 a, l is length, ε₀ is vacuum permittivity constant, and ε_(r)is the relative dielectric constant of the PCB.

With reference to FIGS. 4 and 10-15, components of conditioning circuit301 of the sensor 300 is shown. Since the coil 302 provides adifferentiating response, the output must be integrated to provide theactual response through the conditioning circuit 301 of the sensor 300.The output of the coil 302 is integrated to produce a signal that isproportional to the current in the active lead 228 a. The conditioningcircuit 301 provides integration with the integrator 312. This allowsfor easy adjustability of the sensor gain, utilization in the controlloop and processing by an analog-digital converter. Gain may be set byadjusting the frequency setpoint of the integrator 312. The setpoint maybe achieved by selection of hardware component values (e.g., discreteresistor or capacitor substitution), selection of software values (e.g.,digital or analog potentiometers or adjustable capacitors), includingprogrammable gain amplifiers as described in detail below, orcombinations thereof.

The gain amplifier 306 of the conditioning circuit 301 is shown in FIG.10 and includes a pair of operational amplifiers 306 a and 306 bconfigured to provide differential gain without adding to thecommon-mode gain. The sensor signal from the coil 302 is provided to thepositive terminals of the amplifiers 306 a and 306 b. The outputs of theamplifiers 306 a are interconnected by a gain setting voltage dividernetwork 306 c including three resistors 306 d, 306 e, 306 f. Terminalresistors 306 d and 306 f are coupled in parallel with capacitors 306 gand 306 h, respectively. The signal from the parallel circuits iscoupled to the negative terminals of the amplifiers 306 a and 306 b,which provide closed-loop feedback thereto. Capacitors 306 g and 306 hprovide amplifier stabilization and may also provide for the integrationof the signal.

The output of each of the operational amplifiers 306 a and 306 b isprovided to the differential to single-ended amplifier 308, which isshown in FIG. 11. In particular, the output of the amplifiers 306 a and306 b is supplied to the positive and negative inputs of the amplifier308. The amplifier 308 combines the output of the amplifiers 306 a and306 b to provide a single output to the bandpass filter 310. Theamplifier 308 includes a closed feedback circuit having a referencesignal connected to ground including a resistor 308 a, which isconnected in series with a capacitor 308 b that is coupled in parallelwith a resistor 308 c. The bandpass filter 310 includes a high-passfilter 309 and a low-pass filter 311 as shown in FIGS. 12 and 13,respectively. In embodiments, the output from the amplifier 308 may bepassed through the high-pass filter 309 before being passed through thelow-pass filter 311, or vice versa.

The high-pass filter 309 is configured to pass high frequencies andattenuate lower frequencies. The high-pass filter 309 includes anoperational amplifier 309 a. The output from the amplifier 308 isprovided to the input of the amplifier 309 a through a first capacitor309 b coupled in series with a second capacitor 309 c and a firstresistor 309 d and a second resistor 309 e. The negative input of theamplifier 309 a is provided by a feedback loop from a third resistor 309f coupled in series with a grounded fourth resistor 309 g.

The low-pass filter 311 is configured to pass low frequencies andattenuates higher frequencies. The low-pass filter 311 includes anoperational amplifier 311 a. The input from the high-pass filter 309 isprovided to the input of the amplifier 311 a through a first resistor311 b coupled in series with a second resistor 311 c and a firstcapacitor 311 d and a second capacitor 311 e. The negative input of theamplifier 311 a is provided by a feedback loop from a third resistor 311f coupled in series with a grounded fourth resistor 311 g.

Since the voltage that is induced in the current sensor coil 302 isproportional to the rate of change of current that is flowing throughthe active lead 228 a, the integrator 312 is utilized to provide anoutput signal that is proportional to the sensed current. Inembodiments, a leaky integrator may be used. As used herein the term“leaky integrator” refers to an integrator having a low-pass filter asdescribed in further detail below with respect to FIG. 14. Theintegrator 312 includes an amplifier 312 a with a positive input thereofcoupled to a ground. The input from the bandpass filter 310 is fedthrough a low-pass filter 312 b, which includes a first resistor 312 ccoupled in series with a second resistor 312 d that is coupled inparallel with a capacitor 312 e. The second resistor 312 d and thecapacitor 312 e are also coupled to the output of the amplifier 312 athereby providing a closed loop feedback thereto. The input signal isthen fed to the negative input of the amplifier 312 a.

The integrator 312 provides a negative slope of voltage gain versesfrequency. This compensates, or flattens the opposite slope of thesignal coming from the coil 302. Further, the integrator 312 hasextremely high DC gain. The frequency band of interest for the generator200 is well above DC. The integrator gain would create problems if a DCoffset were present at its input. The high-pass portion of the band-passfilter 310 reduces the low frequency components and reduces any DCoffset, which mitigates issues caused by the integrator's amplificationof these components.

FIG. 15 shows a graph 500 illustrating individual gain response of thecoil 302, the integrator 312, and the combined response of the coil 302and the integrator 312. The graph 500 shows the overall response of thecoil 302 as a plot 502, the response of the integrator 312 as a plot504, and the combined response of the coil 302 and the integrator 312 ofthe sensor 300 as a plot 506, which is a combination of the plots 502and 504. Frequency, f1, is determined by the response of the integrator312 and frequency, f2, is determined by the resonant frequency of thecoil 302.

With reference to FIGS. 16 and 17, the active lead 228 a carries bothcommon-mode (CM) and differential-mode (DM) current. For the purpose ofmeasuring energy delivered to the patient, DM current can provide usefuldata. Thus, having a system and method of separating the DM current fromthe CM current in a conductor would then allow for more accuratesensors. In a single-conductor Rogowski coil, the CM current and DMcurrent are indistinguishable from one another.

With continued reference to FIG. 17, by adding a second conductor,namely, the return lead 228 b, and appropriately orienting the returnlead 228 b through differential-mode RF current sensor 600 a signal as afunction of the DM current. The relationship between the measuredcurrent and the sensor signal V_(signal) depends on the core being usedin the RF current sensor.

As illustrated in FIG. 17, the CM currents on the active lead 228 a andreturn lead 228 b pass through the center of the current sensor 600, butin opposite directions. The flux produced by CM currents cancel eachother out, and the current sensor 600 produces zero signal in proportionto the CM current. The DM currents pass through the current sensor 600in the same direction due to the routing of the active lead 228 a andreturn lead 228 b, namely, looping of the return lead 228 b. The fluxproduced by DM currents are additive, and the current sensor 600produces a signal that is based on the sum of (e.g., twice of) the DMcurrent. If an iron or ferrite core is being used, then V_(signal) isproportional to the DM current, thus in FIG. 16, V_(signal) isproportional to the sum of CM and DM currents and in FIG. 17 V_(signal)is proportional to the sum of only the DM currents. If an air core isbeing used, then V_(signal) is proportional to time rate of change ofV_(signal), thus in FIG. 16, V_(signal) is proportional to a derivativeof the sum of CM and DM currents and in FIG. 17 V_(signal) isproportional to the sum of time derivative of only the DM currents.Although the above-described embodiment is related to a Rogowski coil asa current sensor, the disclosed orientation of the active and returnleads may be applied to any type of a current-sense transformer.

FIG. 18 shows a current sensor assembly 604 including thedifferential-mode RF current sensor 600 and a fully differentialcondition circuit 650 according to the present disclosure. The currentsensor 600 includes a current sensor coil 602 and is shown schematicallyin FIG. 19. The current sensor 600 is configured to measure individualfirst and second currents of active and return leads 228 a and 228 b ora net current. Current transformers are configured to measure eithercommon-mode current or differential-mode current flow. In a typicalapplication using power electronics, such as an inverter for generatingalternating current, complex currents flow which have both differentialand common-mode components which make up the totality of the flowingcurrent.

The current flowing through each of the leads 228 a and 228 b generatesa corresponding magnetic field within the current sensor 600. The netmagnetic field then affects the current sensor 600, which detects thedifferential-mode current. The embodiment of the current sensor coil 602of FIG. 19 is configured as a differential-mode current sensor since itallows for use with multiple active and return leads 228 a, 228 b and228 c, 228 d (FIG. 33).

The current sensor 600 and the conditioning circuit 650 provide acompletely differential signal, which provides better noise immunity.First and second terminals 612 a and 612 b of the current sensor coil602 are coupled to the conditioning circuit 650. Current sensor coil 602also includes a third terminal 612 c as described in further detailbelow with respect to FIG. 26A.

Each of the first and second terminals 612 a, 612 b is coupled to adifferential integrator 637, which includes a plurality of resistors 635a, 635 b. The differential integrator 637 compensates for the derivativenature of the sensor signal from the current sensor coil 602 asdescribed above with respect to the current sensor coil 302. One or moreof the resistors 635 a, 635 b may be coupled to differential gainswitches (e.g., MOSFETs, analog switches, relays etc.) 636 a, 636 b,respectively. The switches 636 a, 636 b are configured to change thevalue of the resistors 635 a, 635 b, respectively, to adjust the gain ofthe conditioning circuit 650.

The resistors 635 a, 635 b are coupled to input terminals of anamplifier 638. The differential integrator 637 also includes capacitors638 a, 638 b coupled to the amplifier 638. The differential integrator637 is, in turn, coupled to an active bandpass filter 640, which alsoincludes an amplifier 641 and associated circuit components. Thebandpass filter 640 is then coupled to an analog-to-digital converter642, which then transmits the converted digital signal to the controller224.

FIG. 20 is a graph 700 of a gain response of the current sensor assembly604 of FIG. 18 according to the present disclosure. The graph 700 showsindividual and combined gain responses of the current sensor coil 602,differential integrator 637, and the bandpass filter 640. The graph 700shows the overall response of the current sensor coil 602 as a plot 702,the response of the differential integrator 637 as a plot 704, and theresponse of the bandpass filter 640 as a plot 706. The graph 700 alsoshows the combined response of the current sensor coil 602, differentialintegrator 637, and the bandpass filter 640 as a plot 708, which is acombination of the plots 702, 704, and 706. Frequency, f1, is determinedby the response of the differential integrator 637 and the bandpassfilter 640, and frequency, f2, is determined by the bandpass filter 640.

In certain situations, the RF energy passing through the leads 228 a and228 b may have relatively high voltage but low current. Undesiredvoltage signal from the leads 228 a and 228 b, which acts as primaryconductors can couple to the current sensor coil 602, which acts as asecondary winding, producing a significant error signal. The presentdisclosure provides for systems and methods for reducing the errorsignal due to voltage coupling between the active leads 228 a and 228 band the current sensor coil 602. In particular, the present disclosureprovides for specific arrangement of the active and/or return leads 228a, 228 b relative to the current sensor coil 602 such that the undesiredvoltage signal is coupled as a common-mode signal and is then cancelledor reduced by the common rejection capabilities of the conditioningcircuit 650. The present disclosure also provides for shielding thecurrent sensor coil 602 to minimize coupling of the voltage signal. Inembodiments, any combinations of arrangement of the active and/or returnleads 228 a, 228 b and/or shielding may be utilized to minimize couplingof the voltage signal.

With reference to FIGS. 21 and 22, the voltage coupling due to parasiticcapacitance is described. FIGS. 21 and 22 illustrate the generator 200including the RF amplifier 228 supplying RF current, Ip, through theactive lead 228 a with the current sensor coil 602 sensing the primarycurrent, Ip, passing therethrough. The primary current, Ip, induces asecondary current, Is, in the current sensor coil 602, which develops avoltage, Vo.

In situations where the voltage at the active lead 228 a is relativelylarge but the primary current, Ip, is low (e.g., near zero), theresulting Vo should also be near zero. With reference to FIG. 22, thehigh voltage capacitively couples from the active lead 228 a to thecurrent sensor coil 602, as represented schematically by a parasiticcapacitance Cp1, which produces an erroneous output voltage.

FIG. 23 shows an embodiment of the present disclosure for reducing oreliminating erroneous output voltage signal output by the conditioningcircuit 650. The present disclosure provides for a system of positioningthe active leads 228 a and/or return leads 228 b in such a way as tobalance the capacitive coupling therefrom to the current sensor coil602. The conditioning circuit 650 then reduces the erroneous outputvoltage due to its common-mode rejection capability.

The active lead 228 a is passed through the current sensor coil 602 togenerate a second parasitic coupling capacitance, Cp2, which is alsocoupled to the current sensor coil 602. In particular, the capacitancesCp1 and Cp2 are coupled symmetrically about the sensor current sensorcoil 602. The capacitance Cp2 couples a voltage from the active lead 228a to the current sensor coil 602 similarly to the capacitance Cp1,thereby balancing the circuit such that the resulting voltage is acommon-mode voltage, which is then rejected by the conditioning circuit650.

FIG. 24 shows another embodiment of the present disclosure for reducingor eliminating erroneous output voltage by the conditioning circuit 650.The current sensor 600 includes one or more shielding members 606disposed between the active leads 228 a and the current sensor coil 602to prevent or reduce the voltage coupling from active lead 228 a tocurrent sensor coil 602.

FIGS. 25A-E show an embodiment of the current sensor 600 including acircular current sensor coil 602 disposed on a printed circuit board(PCB) 601, which may be formed using the techniques described above withrespect to the current sensor coil 302 of FIGS. 5-9. The current sensor600 includes one or more active leads 228 a, 228 c and return leads 228b, 228 d passing through an opening 603 of the current sensor coil 602.The leads 228 a, 228 b, 228 c, 228 d may be any suitable conductiveleads (e.g., wires) having an insulating sheath. In embodiments, theleads 228 a, 228 b, 228 c, 228 d may be printed as conductive traces onthe PCB 601 and passed through the current sensor coil 602 as vias, suchas traces 408 a and 408 f and via 409 a as described above with respectto FIGS. 5 and 9.

The current sensor 600 also includes a pair of shielding members 606 aand 606 b disposed over upper and lower surfaces of the current sensorcoil 602. With reference to FIG. 25E, the shielding member 606 a isshown and described, which is substantially similar to the shieldingmember 606 b. The shielding member 606 a is formed from a conductivematerial and is coupled to a ground “g” as shown in FIG. 24. Theshielding member 606 a includes an opening 608 therethrough for passageof leads 228 a, 228 b, 228 c, 228 d. The shielding member 606 a isconfigured and dimensioned to substantially cover the current sensorcoil 602. Since the current sensor coil 602 is disposed on the PCB 601,the shielding members 606 a and 606 b may be substantially flat. Theshielding member 606 a may be a discrete conductive layer attached tothe PCB 601 on which the current sensor coil 602 is disposed using anysuitable fasteners, adhesives, and combinations thereof.

In embodiments, the shielding members 606 a, 606 b, may be formed aslayers on the PCB 601 as shown in FIG. 25E. As a result, the PCB 601 mayinclude additional dielectric layers (e.g., outer dielectric layers) toaccommodate the shielding members 606 a, 606 b as integrated layers. Theshielding members 606 a, 606 b may be printed as a conductive layer onthe PCB 601 as described above with respect to the printing of thecurrent sensor coil 302. This configuration may be used in embodimentsin which the leads 228 a, 228 b, 228 c, 228 d are formed as vias andtraces. In particular, an additional dielectric layer may be disposed ontop of the conductive trace 408 b (FIG. 8), on top of which theshielding member 606 a is then formed, as well as below conductive trace408 e (FIG. 8), below which the shielding member 606 b is then formed.

The current sensor 600 also includes a pair of opposing spacers 610 aand 610 b. The spacers 610 a and 610 b are formed from a dielectricmaterial and when assembled define an opening therethrough which alignswith the opening 603 of the current sensor coil 602. The leads 228 a,228 b, 228 c, 228 d are wrapped around and through the spacers 610 a and610 b as shown in FIG. 25D to maintain the leads 228 a, 228 b, 228 c,228 d in a predetermined spatial relationship relative to themselves andthe current sensor coil 602 to cancel and/or reduce the effects ofparasitic capacitance as described above. The current sensor 600 alsoincludes a pair of opposing housing portions 630 a, 630 b enclosing theinterior components of the current sensor 600. The housing portions 630a, 630 b also secure leads 228 a, 228 b, 228 c, 228 d relative to eachother and the current sensor coil 602.

With reference to FIGS. 26A-31C, embodiments of a single-wireorientation of the active lead 228 a about the current sensor coil 602are shown. The coil 602 includes forming an inner coil 605 and an outercoil 607. With specific reference to FIG. 26A, the current sensor coil602 at a first end 609 includes two terminals 612 a and 612 b coupled tothe outer coil 607 and the third terminal 612 c coupled the inner coil605. The third terminal 612C also couples the inner coil 605 to theground at the first end 609. The inner coil 605 center taps the outercoil 607 at a second end 611 as described in further detail below withrespect to FIGS. 26B and 26C.

With continued reference to FIG. 26A, the outer coil 607 includes asemi-circular first portion 607 a and a semi-circular second portion 607b and the inner coil 605 includes a semi-circular first portion 605 aand a semi-circular second portion 605 b. The first and second portions605 a, 605 b and 607 a, 607 b are disposed symmetrically (e.g., on leftand right sides) about an axis “X-X” defined between diametricallyopposed (e.g., 180° apart) first and second ends 609 and 611 of thecurrent sensor coil 602, respectively.

With reference to FIGS. 26B and 26C, enlarged schematic views of thefirst and second ends 609 and 611 of the current sensor coil 602,respectively, are shown. The first portion 607 a of the outer coil 607is coupled between the first terminal 612 a on top (e.g., at first end609) and a first connection 611 a of the first portion 605 a of theinner coil 605 on the bottom (e.g., at second end 611). The secondportion coil 607 b of the outer coil 607 is coupled between the secondterminal 612 b on top (e.g., at first end 609) and a second connection611 b of the second portion 605 b of the inner coil 605 on bottom (e.g.,at second end 611). Each of the first and second portions 605 a, 605 bof the inner coil 605 is coupled between the third terminal 612 c at thefirst end 609 of the current sensor coil 602 and their respectiveconnections 611 a, 611 b at second end 611 of the current sensor coil602.

With reference to FIGS. 26D-F, a top portion of the active lead 228 a ispassed across a top surface 602 a of the current sensor coil 602 and isdisposed in a −α orientation, e.g., at an angle α relative to the axis“X-X.” A bottom portion of active lead 228 extends through the opening603 and across a bottom surface 602 b of the current sensor coil 602such that the bottom portion of active lead 228 a is disposed in a +αorientation relative to the axis “X-X.” It should be appreciated thatmovement in the −α direction along sensor coil 602 in FIG. 26Dcorresponds to movement in a downwardly direction along sensor coil 602in FIG. 26F. Similarly, movement in the +α direction along sensor coil602 in FIG. 26D corresponds to movement in an upwardly direction alongsensor coil 602 in FIG. 26F.

The active lead 228 a is disposed symmetrically about the axis “X-X”across the top and bottom surfaces 602 a, 602 b of the current sensorcoil 602 such that the erroneous voltage signals, Ve, generated by theactive lead 228 a are canceled out. In particular, the portion of theactive lead 228 a disposed on the top surface 602 a and the portion ofthe active lead 228 a disposed on the bottom surface 602 b aresymmetrical about the axis “X-X.”

The top portion of active lead 228 a creates capacitive coupling orparasitic capacitance C_(t) within the sensor soil 602 at location L1(FIG. 26F). Similarly, the bottom portion of active lead 228 a createscapacitive coupling or parasitic capacitance C_(b) within sensor coil602 at location L2 (FIG. 26F). Two operating points identified as “P1”and “P2” in FIG. 26E correspond to locations L1 and L2, respectively, inFIG. 26F. An error signal Ve is generated at location L1 and an errorsignal Ve is created at location L2. The differential amplifier takesthe difference of these two error signals to generate an output of zero(i.e., Vx=Ve−Ve=0). With the inner coil 605 attached at the center ofthe outer coil 607, the capacitive coupling is balanced, causing theerroneous signal to be a common-mode voltage. Thus the differentialcircuitry causes the erroneous error signal to be removed. Accordingly,the embodiments of sensor circuit 602 provided above are balanced, haveshielding, or are both balanced and have shielding such that thecircuits produce little to no output signal Vx when there is no inputcurrent.

FIG. 26E shows a plot 800 illustrating a logarithmic ratio of outputvoltage Vx of the amplifier to the voltage on active lead 228 a vs.angular location. The logarithmic ratio is calculated using the equationof 20 Log(|V_(x)|/|V_(in)|), in which Vx is the output of thedifferential amplifier and V_(in) is the voltage on active lead 228 a.Operating points “P1” and “P2” correspond to the locations L1 and L2 ofthe parasitic capacitances C_(t), C_(b) shown in FIG. 26F. The slope ofthe graph illustrates sensitivity, i, of the output voltage Vx of thedifferential amplifier as a function of positional angle between theaxis “X-X” and the active lead 228 a. As the angle increases from about0° to about 90°, the sensitivity to erroneous voltage signals Ve of thecurrent sensor coil 602 decreases. This relationship may be used tolocate the active lead 228 a relative to the axis “X-X” to obtain themost accurate reading of the current passing therethrough whileminimizing the interference caused by the erroneous voltage signals Ve.

With reference to FIGS. 27A-B, 28A-B, 29A-C, 30A-C, and 31A-C, multipleembodiments of single wire configurations of the sensor coil 602 areshown. With specific reference to FIGS. 27A and 27B, sensor coil 602includes a length of wire, namely the inner coil 605, passing throughthe middle of the sensor coil 602 such that the wire extends from afirst end 609 to a second end 611 of sensor coil 602. The top surface ofsensor coil 602 in FIG. 27A corresponds to the left side of sensor coil602 in FIG. 27B. Similarly, the bottom surface of sensor coil 602 inFIG. 27A corresponds to the right side of sensor coil 602 in FIG. 27B.

With respect to FIG. 28A, sensor coil 602 is shown, differing fromsensor coil 602 shown in FIG. 27A by the addition of wire 228 a runningthrough the central opening in sensor coil 602. Assuming there is nocurrent traveling through the wire 228 a, the output of the sensor coil602 should be ideally zero. The wire 228 a is in close proximity to thesensor coil 602 and will capacitively couple via Ct an undesired errorvoltage, Ve, from the wire 228 a to the sensor coil 602. The position ofwire 228 a relative to the sensor coil 602 determines the location atwhich the error voltage is coupled, and thus affects how the circuitprocesses the signal. This, in turn, affects the output signal Vo.

FIGS. 29A-C, FIGS. 30A-C, and FIGS. 31A-C show additional single-wireconfigurations of the sensor coil 602. With specific reference to FIG.29A, the wire 228 a is routed on the top and the bottom of sensor coil602. Thus, each of the top and bottom portions of wire 228 a couples tothe sensor coil 602 forming a parasitic capacitance C_(t), C_(b), asshown in FIG. 29C. Since both C_(t) and C_(b) are at 0 degrees relativeto the axis “X-X,” they are capacitvely coupled to the center tap of thesensor coil 602, which is grounded and therefore signal Ve is zero,hence, Vx is also zero. This corresponds to the operating points “P1”and “P2” shown in FIG. 29B representative of a low error signal.Although this configuration provides for a low error signal, anymovement in α yields a large change in error voltage.

FIG. 30A shows both top and bottom portions of active lead 228 adisposed in +α direction. As shown in FIG. 30C, the top and bottomportions of active lead 228 a are capacitively coupled at the samelocation due to the overlap of the active lead 228 a on the sensor coil602, but off the center tap due to the placement of active lead 228 a inFIG. 30A as compared to the configuration shown in FIGS. 29A-C. An errorsignal Ve, is coupled into the sensor coil 602 by each of the top andbottom portions of the active lead 228 a. This corresponds to theoperating points “P1” and “P2” shown in FIG. 30B representative of errorsignal. The error signal is coupled to the negative input of theamplifier, and produces an output of Vx=−2Ve, since two active leads 228a are coupling to the same location.

FIG. 31A shows the top and bottom portions of active lead 228 a moved inthe −α direction. The the top and bottom portions of active lead 228 aare capacitively coupled at the same location due to the overlap of theactive lead 228 a on the sensor coil 602, but off the center tap due tothe placement of active lead 228 a in FIG. 31A as compared to theconfiguration shown in FIGS. 29A-C. An error signal Ve, is coupled intothe sensor coil 602 by each of the top and bottom portions of the activelead 228 a. This corresponds to the operating points “P1” and “P2” shownin FIG. 31B representative of error signal. The error signal is coupledto the positive input of the amplifier, and produces an output ofVx=+2Ve, since two active leads 228 a are coupling to the same location.

With reference to FIGS. 32A and 32B, a two-wire orientation of theactive lead 228 a and return lead 228 b about the current sensor coil602 is shown schematically. The active and return leads 228 a, 228 b arepassed across the top surface 602 a of the current sensor coil 602,through the opening 603, and across the bottom surface 602 b of thecurrent sensor coil 602. The top and bottom portions of the active lead228 a are symmetrical about the axis “X-X” at a first angle, −α and +α,respectively, and the top and bottom portions of the return lead 228 bare symmetrical about the axis “X-X” at a second angle, +β and −β,respectively. The active and return leads 228 a, 228 b may be disposedat an angle ±α, ±β, respectively, from about 0° to about 90° relative tothe axis “X-X.” In embodiments, angles ±α, ±β may be the same, as shownin FIG. 32B, or different, as shown in FIG. 32A.

With reference to FIG. 33, multiple active leads 228 a and 228 c andmultiple return leads 228 b and 228 d may be used depending on thenumber of outputs within the generator 200, e.g., bipolar, monopolar,etc. The active and return leads 228 a, 228 c and 228 b, 228 d are alsodisposed in a symmetrical relationship (e.g., transverse to the axis“X-X”) relative to each other about the axis “X-X,” such that theerroneous voltage signals are cancelled.

In embodiments, any number of active and return leads 228 a, 228 c and228 b, 228 d may be wrapped about the current sensor coil 602 asillustrated in FIG. 33. This configuration may include two pairs ofactive and return leads 228 a, 228 c, and 228 b, 228 d, which may bedisposed in an overlapping relationship, such that active and returnleads 228 a, 228 c and 228 b, 228 d, respectively are disposed over eachother. This arrangement may be used with a differential-mode currenttransformer configuration.

While several embodiments of the disclosure have been shown in thedrawings and/or discussed herein, it is not intended that the disclosurebe limited thereto, as it is intended that the disclosure be as broad inscope as the art will allow and that the specification be read likewise.Therefore, the above description should not be construed as limiting,but merely as exemplifications of particular embodiments. Those skilledin the art will envision other modifications within the scope and spiritof the claims appended hereto.

What is claimed is:
 1. A sensor for sensing current, the sensorcomprising: a current sensor coil defining an opening therethrough andincluding: an outer coil; a pair of first and second terminals coupledto the outer coil at a first end of the current sensor coil; and aninner coil coupled to and disposed within the outer coil; and at leastone active lead and at least one return lead each passing through theopening of the current sensor coil, wherein the current sensor coil isconfigured to output a differential signal indicative of a currentwithin the at least one active lead or the at least one return lead, theat least one active lead including: a top portion extending parallelwith and over a top surface of the current sensor coil at a firstnon-zero acute angle relative to an axis that extends through the firstend of the current sensor coil and a center of the opening of thecurrent sensor coil; and a bottom portion extending parallel with andover a bottom surface of the current sensor coil at a second non-zeroacute angle relative to the axis, the first and second angles beingsymmetrical relative to each other about the axis.
 2. The sensoraccording to claim 1, further comprising: a conditioning circuitconfigured to at least one of integrate, amplify, or filter thedifferential signal to output a processed signal indicative of thecurrent.
 3. The sensor according to claim 1, further comprising: atleast one shielding member disposed over the outer coil.
 4. The sensoraccording to claim 3, wherein the current sensor coil is disposed withina printed circuit board.
 5. The sensor according to claim 4, wherein theprinted circuit board includes: a plurality of outer conductive traceseach being coupled to at least one of the active lead or the returnlead, the plurality of outer conductive traces being interconnected byat least one via through the printed circuit board.
 6. The sensoraccording to claim 5, wherein the printed circuit board includes: a topdielectric layer; a first dielectric intermediate layer; a bottomdielectric layer; and a second dielectric intermediate layer; andwherein the outer coil includes: a plurality of top conductive tracesdisposed between the top dielectric layer and the first dielectricintermediate layer of the printed circuit board; a plurality of bottomconductive traces disposed between the bottom dielectric layer and thesecond dielectric intermediate layer of the printed circuit board,wherein the outer conductive traces are disposed over outer surfaces ofthe bottom and top dielectric layers; and a plurality of inner and outervias interconnecting the pluralities of top and bottom conductivetraces.
 7. The sensor according to claim 6, wherein the inner coilincludes: at least one conductive trace disposed within the outer coiland between the first and second dielectric intermediate layers of theprinted circuit board.
 8. The sensor according to claim 6, wherein theshielding member is disposed over an outer dielectric layer disposedover the outer surface of at least one of the top dielectric layer orthe bottom dielectric layer.
 9. The sensor according to claim 2, whereinthe current sensor coil are has a second end disposed on an oppositeside of the opening of the current sensor coil as the first end, each ofthe outer coil and the inner coil includes first and second portions,the first and second portions being separated at the second end of thecurrent sensor coil.
 10. The sensor according to claim 9, wherein theconditioning circuit is coupled to the first and second terminals, whichare coupled to the respective first and second portions of the outercoil at the first end of the current sensor coil, and the first andsecond portions of the inner coil are coupled to a third ground terminalat the first end of the current sensor coil.
 11. The sensor according toclaim 10, wherein the first portions of the outer coil and the innercoil are coupled to each other at the second end and the second portionsof the outer coil and the inner coil are coupled to each other at thesecond end.
 12. The sensor according to claim 2, wherein theconditioning circuit is fully differential.
 13. A sensor for sensingcurrent, the sensor comprising: a current sensor coil defining anopening therethrough and diametrically opposed first and second ends,the current sensor coil including: an outer coil including a firstsemi-circular portion and a second semi-circular portion; and an innercoil disposed within the outer coil and including a first semi-circularportion and a second semi-circular portion, wherein the firstsemi-circular portions and the second semi-circular portions of theinner and outer coils are separated at the second end; and at least oneactive lead passing through the current sensor coil, wherein the currentsensor coil is configured to output a signal indicative of a currentwithin the at least one active lead, the at least one active leadincluding: a top portion extending along a plane defined by a topsurface of the first semi-circular portion of the outer coil at a firstnon-zero acute angle relative to an axis that extends through the firstend of the current sensor coil and a center of the opening of thecurrent sensor coil; and a bottom portion extending along a planedefined by a bottom surface of the second semi-circular portion of theouter coil at a second non-zero acute angle relative to the axis, thefirst and second angles being symmetrical relative to each other aboutthe axis.
 14. The sensor according to claim 13, further comprising atleast one shielding member disposed over the outer coil and defining asecond opening therethrough in alignment with the opening of the currentsensor coil.
 15. The sensor according to claim 13, further comprising: aconditioning circuit coupled to the inner and outer coils at the firstend and configured to at least one of integrate, amplify, or filter adifferential signal to output the signal indicative of the current. 16.The sensor according to claim 13, further comprising at least one returnlead passing through the current sensor coil, wherein the current sensorcoil is configured to output a second signal indicative of a currentwithin the at least one return lead.
 17. The sensor according to claim16, wherein the at least one return lead includes: a top portionextending along the plane defined by the top surface of the firstsemi-circular portion of the outer coil; and a bottom portion extendingalong the plane defined by the bottom surface of the secondsemi-circular portion of the outer coil.